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Diode and Ytterbium fiber marking laser

BIG SMARK

Sisma renews its design for the new generation of laser system for microprocessing with fiber technology. Increased functionality of the source allow engraving, marking and microcutting to meet the highest technical standards available. Door opens on 3 sides to facilitate access, wide work chamber (500x500 mm), maximum height of piece 530 mm (F100) and can be connected with all Sisma accessories making the system highly flexible. Awareness of the process and applicative requirements, as well as constructive features, make the Big Smark an innovative system simple and productive.

Control: Windows PC. Software SLC - PRISMA

Interface: PLC, data network (ethernet), digital I/O

Software: Software for files management and marking parameters defining. Types of accepted files: Svg, Dxf, Hpgl, Bmp, Jpg, Pit; control system for axis; camera for object centering and positioning engraving cycles. Entirely developed in Sisma.

Options: High precision rotary axis, dragging system with winder, dynamic measuring device, fumes aspirator, static clamping device.

BIG SMARK 200F

Laser source Yb
Wavelength 1064 nm
Average laser power 20 W
Pulse frequency 1÷500 kHz
Pulse duration 260/40 ns
Max pulse energy 1/0,21 mJ
Beam quality ≤ 1,6 M²
Laser spot diameter 20 µm

Max marking speed 2000 mm/s
Focal lenses F100, F160 (standard), F254, F330
4th axes Optional
Guide laser Class 2M Red Laser Diode; λ=650 nm; 2 mW
Working temperature 10°C to 35°C
Cooling system Forced-air
Working chamber 500 x 500 x 380 mm
Power supply 230 V ± 15% 50/60 Hz 1ph 0,8 kW
Dimensions (WxDxH) 650 x 1040 x 1760 mm
Weight 640 kg

BIG SMARK 400F

Laser source Yb
Wavelength 1064 nm
Average laser power 40 W
Pulse frequency 1÷1000 kHz
Pulse duration 10-240 ns
Max pulse energy 0,16-1,33 mJ
Beam quality ≤ 3,5 M²
Laser spot diameter 40 µm

Max marking speed 2000 mm/s
Focal lenses F100, F160 (standard), F254, F330
4th axes Optional
Guide laser Class 2M Red Laser Diode; λ=650 nm; 2 mW
Working temperature 10°C to 35°C
Cooling system Forced-air
Working chamber 500 x 500 x 380 mm
Power supply 230 V ± 15% 50/60 Hz 1ph 0,8 kW
Dimensions (WxDxH) 650 x 1040 x 1760 mm
Weight 640 kg

BIG SMARK 500F

Laser source Yb
Wavelength 1064 nm
Average laser power 50 W
Pulse frequency 1÷500 kHz
Pulse duration 250/40 ns
Max pulse energy 1/0,21 mJ
Beam quality ≤ 1,6 M²
Laser spot diameter 20 µm

Max marking speed 2000 mm/s
Focal lenses F100, F160 (standard), F254, F330
4th axes Optional
Guide laser Class 2M Red Laser Diode; λ=650 nm; 2 mW
Working temperature 10°C to 35°C
Cooling system Forced-air
Working chamber 500 x 500 x 380 mm
Power supply 230 V ± 15% 50/60 Hz 1ph 0,8 kW
Dimensions (WxDxH) 650 x 1040 x 1760 mm
Weight 640 kg

BIG SMARK 700F

Laser source Yb
Wavelength 1064 nm
Average laser power 70 W
Pulse frequency 1÷500 kHz
Pulse duration 260/40 ns
Max pulse energy 1/0,21 mJ
Beam quality ≤ 1,6 M²
Laser spot diameter 20 µm

Max marking speed 5000 mm/s
Focal lenses F100, F160 (standard), F254, F330
4th axes Optional
Guide laser Class 2M Red Laser Diode; λ=650 nm; 2 mW
Working temperature 10°C to 35°C
Cooling system Forced-air
Working chamber 500 x 500 x 380 mm
Power supply 230 V ± 15% 50/60 Hz 1ph 0,8 kW
Dimensions (WxDxH) 650 x 1040 x 1760 mm
Weight 640 kg

BIG SMARK 200F EP

Laser source Yb
Wavelength 1064 nm
Average laser power 20 W
Pulse frequency 1÷1000 kHz
Pulse duration 3-500 ns
Max pulse energy 0,03-1 mJ
Beam quality ≤ 1,6 M²
Laser spot diameter 20 µm

Max marking speed 2000 mm/s
Focal lenses F100, F160 (standard), F254, F330
4th axes Optional
Guide laser Class 2M Red Laser Diode; λ=650 nm; 2 mW
Working temperature 10°C to 35°C
Cooling system Forced-air
Working chamber 500 x 500 x 380 mm
Power supply 230 V ± 15% 50/60 Hz 1ph 0,8 kW
Dimensions (WxDxH) 650 x 1040 x 1760 mm
Weight 640 kg

BIG SMARK 300F

Laser source Yb
Wavelength 1064 nm
Average laser power 30 W
Pulse frequency 1÷500 kHz
Pulse duration 260/40 ns
Max pulse energy 1/0,21 mJ
Beam quality ≤ 1,6 M²
Laser spot diameter 20 µm

Max marking speed 2000 mm/s
Focal lenses F100, F160 (standard), F254, F330
4th axes Optional
Guide laser Class 2M Red Laser Diode; λ=650 nm; 2 mW
Working temperature 10°C to 35°C
Cooling system Forced-air
Working chamber 500 x 500 x 380 mm
Power supply 230 V ± 15% 50/60 Hz 1ph 0,8 kW
Dimensions (WxDxH) 650 x 1040 x 1760 mm
Weight 640 kg

BIG SMARK 1000F

Laser source Yb
Wavelength 532 nm
Average laser power 100 W
Pulse frequency CW 1÷500 kHz
Pulse duration 17/500 ns
Max pulse energy 0,1/1 mJ
Beam quality ≤ 1,6 M²
Laser spot diameter 20 µm

Max marking speed 5000 mm/s
Focal lenses F100, F160 (standard), F254, F330
4th axes Optional
Guide laser Class 2M Red Laser Diode; λ=650 nm; 2 mW
Working temperature 10°C to 35°C
Cooling system Water
Working chamber 500 x 500 x 380 mm
Power supply 230 V ± 15% 50/60 Hz 1ph 0,8 kW
Dimensions (WxDxH) 650 x 1040 x 1760 mm
Weight 640 kg

BIG SMARK GREEN

Laser source Nd:YV04
Wavelength 532 nm
Average laser power 10 W
Pulse frequency 1÷300 kHz
Pulse duration 30 ns
Max pulse energy 0,25 mJ
Beam quality ≤ 1,2 M²
Laser spot diameter 12 µm

Max marking speed 2000 mm/s
Focal lenses F100, F160
4th axes Optional
Guide laser Class 2M Red Laser Diode; λ=650 nm; 2 mW
Working temperature 10°C to 35°C
Cooling system Forced-air
Working chamber 500 x 500 x 380 mm
Power supply 230 V ± 15% 50/60 Hz 1ph 0,8 kW
Dimensions (WxDxH) 650 x 1040 x 1760 mm
Weight 640 kg

BIG SMARK UV

Laser source Nd:YV04
Wavelength 355 nm
Average laser power 3 W
Pulse frequency 1÷300 kHz
Pulse duration 35 ns
Max pulse energy 0,075 mJ
Beam quality ≤ 1,3 M²
Laser spot diameter 7 µm

Max marking speed 2000 mm/s
Focal lenses F160
4th axes Optional
Guide laser Class 2M Red Laser Diode; λ=650 nm; 2 mW
Working temperature 10°C to 35°C
Cooling system Forced-air
Working chamber 500 x 500 x 380 mm
Power supply 230 V ± 15% 50/60 Hz 1ph 0,8 kW
Dimensions (WxDxH) 650 x 1040 x 1760 mm
Weight 640 kg

SISMA