Laser marking systems


Laser system specific for 2D and 3D deep engraving on moulds, punches and electrodes through movement of the laser source on a portal with 3 axes with a range of 350 mm. The centering is done through an high resolution ultra compact camera; working cycles, positioning and programming are managed from the master software.

Control: Windows PC with PCI board, RS232 Software SISMA Laser Controller 

Interfacce: PLC, data network (ethernet), digitals I/O

Software: SLC software for files management marking parameters defining. Accepted extensions SVG, BMP, JPG, HTML, PLT; control system for axis and camera for abject centering, positioning and programming engraving cycles. Entirely developed in SISMA. 

Options: Rotary axis, dragging system with winder, dynamic measuring device, fumes aspirator, static clamping vice.

BSS 200F 3D

Wave lenght 1064nm
Focals F100, F163, F254, F420 mm
Working area 600x800x450h mm
Repeatibility +/- 0,02 mm
Camera CCD 768(h)x 494(V) lines
Cooling system water
Power supply 230V +/- 15% 50/60Hz 1ph
Dimensions 1900x1190x1795h mm
Weight 720 Kgs

BSS 400F 3D

Wave lenght Nd:YAG - 1064 nm
Average power 40W
Peak power 12 kW
Pulse frequency 1 - 200 kHz
Working area with focal F160 100x100 mm
Laser spot diametrer 25 µm
Feeding voltage 230V 50/60Hz monofase
Safety (class) 1
Machine dimensions (LxWxH) 1190x1900x1795 mm
Machine weight 960 Kg