MARKING AND ENGRAVING LASER SYSTEM Archives - Page 2 of 5 - SISMA
BSP PICO

BSP PICO

BSP PICO is a laser marking and engraving machine which uses a picosecond laser source Picosecond laser source This type of source generates pulses lasting only a few picosecond with peak intensities so high that non-linear/multiphoton absorption takes place: the...
BSP

BSP

BSP, 3-axis laser marking and engraving system with base Versatile Compact, solid, with a large working chamber and a 490 mm door opening on three sides. BSP allows to work up to a max volume of 300 x 300 x 300 mm and load pieces up to 20 kg of weight. Sturdy Its...
LWS-M

LWS-M

LWS-M, 3-axis laser marking station with removable and height adjustable working plane. The LWS-M plus version is available with a laser source that can be moved automatically along the X and Z axes and manually along the Y axis. Flexible  The gantry structure, open...
LWS-A

LWS-A

LWS-A, Laser marking stations with three axes Flexible The gantry structure, open on three sides, combined with the possibility of moving or removing the working plane, makes it possible to process heavy and large pieces. LWS systems can be customized to meet every...
SART

SART

SART, laser marking and engraving system with rotating table, on base Highly productive The two-position rotating table system (diameter 700 mm) allows to load/unload the pieces during the marking process, minimizing downtimes. Furthermore, the sturdy structure...