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NEWS AND EVENTS

Sisma at Laserhub Piacenza

We will be attending the first edition of Laserhub, the convention dedicated to innovation and the evolution of laser technology, to be held in Piacenzaon November 11 and 12, 2026.
We look forward to seeing you at Piacenza Expo Italy, Single Pavilion, Booth No. 11, the area dedicated to the most advanced solutions for industrial laser processing and applications.
During the event, we will showcase our latest Sisma technologies, designed to optimize production processes and support companies’ growth in the global market.

SISMA a JGTD Dubai 2026

We will be attending JGTD (Jewellery, Gem & Technology Dubai), one of the most influential international B2B events dedicated to the entire jewellery, gem, and technology sector, which will take place in Dubai from 27 to 29 October 2026.

We look forward to welcoming you at North Hall 21-23, Booth NC 48, inside the DEC (Dubai Exhibition Centre), the area of the exhibition dedicated to technological innovations and cutting-edge solutions for the jewellery industry.

During the event, we will showcase our latest technological solutions dedicated to jewellery manufacturing and processing, developed to support innovation and process evolution in the global market.

Micronora High-Precision Laser Technology | Hall C, Booth 321

We will be participating in Micronora, the leading international trade show for microtechnology, miniaturization, and high-precision manufacturing. The event will take place in Besançon at the Micropolis exhibition center, and you’ll find us in Hall C – Booth 321.

At our booth, you can learn more about our latest laser solutions for microtechnology and speak directly with our experts to develop customized applications.

Plan your visit to Booth 321: contact us to schedule an appointment with our technical staff during the trade show.

SISMA at JGW Hong Kong 2026

From September 16 to 20, we’ll be taking center stage at JGW 2026 —the must-attend global event for the jewelry industry. Come discover how Italian engineering can revolutionize your production.

We will be showcasing our next-generation chain-driven machines—advanced mechanical systems that guarantee millimeter-level precision and uncompromising reliability. Alongside these, we will feature cutting-edge laser welding and laser marking technologies—tools that make all the difference when every detail counts in the crafting of fine jewelry.

All of this is Made in Italy. Innovation, reliability, and superior craftsmanship are at the heart of every machine we produce. We bring this legacy of excellence to Hong Kong so that the world knows that Italy remains the global benchmark for jewelry-making technology.

Come visit us and discover how to transform your production. We look forward to seeing you.

 

SISMA at AMB Stuttgart 2026

From 15 to 19 September AMB 2026 is once again bringing together the industry’s leading players, and SISMA will be a key participant in this major international event, showcasing cutting-edge solutions designed for the manufacturing of the future.

You’ll find us in Hall 5, Booth 5D11, where our team will be ready to guide you in discovering how SISMA’s laser solutions can revolutionize your industrial processes. It’s not just about showcasing products: we want to show you how our expertise provides a concrete solution to the challenges of modern mechanical engineering.

AMB 2026 is an unmissable opportunity to experience firsthand the trends that are shaping the future of manufacturing. SISMA will be there with its advanced manufacturing solutions, ready to demonstrate how technical excellence and innovation can truly optimize your industrial workflows.

Don’t miss this event. We look forward to seeing you in Stuttgart!

Sisma at T.GOLD VicenzaOro September

From September 4th to 8th, we will be returning to our venue in via dell’Oreficeria for T.GOLD VicenzaOro, one of the most prominent international exhibitions dedicated to machinery and technologies for the jewelry industry. This event is a key global meeting point for goldsmiths, jewelry manufacturers, and industry professionals from around the world.

You can find us at Hall 4, Booth 111, where you can experience firsthand our advanced technologies and integrated solutions developed specifically for the jewelry sector. Our systems are engineered to support companies throughout their entire production process, driving innovation, precision, and the evolution of modern jewelry manufacturing.

We look forward to welcoming you, discussing our latest developments, and finding the perfect technological fit for your production needs.

inserti incisi al laser

Laser-engraved chipbreaker grooves on turning inserts

A continuous chip is one of the most subtle enemies in turning operations.

Without a feature to break it, the chip winds itself around the workpiece, the tool, or the spindle.

The consequences are tangible:

  • Safety: the sharp, hot ribbon is a direct danger to the operator.
  • Quality: chips rubbing against the workpiece ruin the surface finish.
  • Tool life: entangled chips can lead to cutting edge chipping.
  • Productivity: a tangle of chips halts any automatic or unattended machining, forcing machine downtime.

The solution is the chipbreaker: a groove machined on the insert’s rake face, right near the cutting edge. As the chip flows across it, it is deflected and curled until it breaks into short, easily manageable fragments.

On standard inserts, the chipbreaker is often already molded during production. However, when it is missing—or on special, reground, or custom-designed tools—the groove must be machined afterwards. There are two ways to achieve this: grinding with a diamond wheel, or laser engraving, which proves more cost-effective, especially when dealing with complex tool geometries.

With laser engraving, the profile is designed in CAD, positioned on-screen over the real image of the insert, and engraved by the laser with precision to the required depth. The result is a more flexible, repeatable, and economical process, especially for special tools and small batches.

There is also a practical advantage: the same laser machine that engraves the chipbreaker can also perform the marking of codes, logos, and traceability data on the tools, making the most of a single investment.

Process with EASY-GO (20W fiber laser)

For the test, EASY-GO was used—Sisma’s 20W fiber laser marker—with a specific goal: to engrave a 0.5 mm deep chipbreaker groove on the insert.

  1. Insert positioning. The tool is fixed on an adjustable spherical support with a magnetic base, oriented so that the surface to be engraved is perfectly horizontal relative to the laser beam.
  2. Image acquisition. The CVS Coaxial Vision System frames the insert through the same optical axis as the laser. The Sisma SLC3 software then displays the real image of the part and its exact position in the marking field.
  3. Project import. The engraving design, which can be created with any 3D CAD, is imported onto the image. The file defines the section, path, and dimensions of the groove.
  4. On-screen alignment. The operator positions the profile relative to the cutting edge directly on the real image, without mechanical references or dedicated jigs.
  5. Engraving. The laser removes material in successive layers, following the programmed path until reaching the design depth of 0.5 mm.

 

 

 

 

 

 

Cycle time: 40″

For those who produce or recondition turning tools, laser engraving the chipbreaker brings measurable benefits:

  • Design freedom: the groove profile is created in CAD and can be optimized for every material and cutting condition.
  • No wear to manage: without a grinding wheel, there are no dressings, replacements, or profile variations over time.
  • Cutting edge integrity: the absence of contact eliminates mechanical stress on the insert.
  • Positioning precision: CVS coaxial vision ensures the engraving falls exactly where it was designed.
  • Production flexibility: changing the tool or profile means changing a file, not the equipment, with clear advantages for prototypes and small batches.
  • Greater machine autonomy: short, controlled chips make automatic and unattended machining possible.

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